Ceramic Substrates are used in many electronic applications where a thin insulating layer of thermally stable material is required to conduct heat away from electronic components whilst electrically insulating them, and material is Alumina, Zirconia, Aluminum Nitride and Silicon Nitride.
Properties with excellent insulation, high mechanical strength, high thermal conductivity, low expansion coefficient, small
dielectric constant, high-temperature resistance, excellent erosion and wear resistance, good quality in chemical shock heat and cold.
Properties with excellent insulation, high mechanical strength, high thermal conductivity, low expansion coefficient, small
dielectric constant, high-temperature resistance, excellent erosion and wear resistance, good quality in chemical shock heat and cold.
We offers a range of sizes and thicknesses substrates in alumina, zirconia, silicon nitride and aluminum nitride material.
• Lead Time: 1-2 days(Standard Size in stock), 5-7 days(Customized size).
• Min Thickness: 0.1mm
• Any size can be customized according to the drawing
• Lead Time: 1-2 days(Standard Size in stock), 5-7 days(Customized size).
• Min Thickness: 0.1mm
• Any size can be customized according to the drawing
Laser machining Service for Ceramic substrate:
- Laser Cutting
- Laser cutting of ceramic substrates to form any desired shape (cut-outs, outlines).
- Tolerance: +/-0.02mm
- Thickness: 0.1 – 2.0mm
- Max. dimension: 150*200mm
- Laser Drilling
Laser drilling of smallest hole diameters in trepanning or percussion mode. Microvias with diameters down to 100 µm.
Tolerance: +/-0.02mm
Min drilling diameter: 0.1mm
- Laser Scribing
Laser scribing of ceramic substrates to generate a defined break line (perforation or groove) for singulation of the substrates.
Laser pulse depth: 0.1-0.5mm
Max Drilling thickness: 1.5mm
- Laser Marking
Laser marking, on the other hand, is a broader category of methods to leave marks on an object, which also includes color change
due to chemical/molecular alteration, charring, foaming, melting, ablation, and more.
